Army Aviation and Missile Research, Development and Engineering Center (AMRDEC)
Aspen Aerogels
Augmentix
Defense Threat Reduction Agency (DTRA)
Department of Energy (DOE)
Department of Transportation (DOT)
Downhole Technology
Dyna-Tek
Evonik
Exquadrum
Federal Aviation Administration (FAA)
Fiber Materials Inc. (FMI)
Fifth Gait Technologies
Firefly Space Systems
Fire Research Laboratories (FRL)
Johns Hopkins University Applied Physics Lab (JHUAPL)
Masdar Institute of Science and Technology, UAE
Missile Defense Agency (MDA)
Nanotailor
National Science Foundation (NSF)
National Aeronautics and Space Administration (NASA)
Naval Sea Systems Command (NAVSEA)
Naval Surface Warfare Center (NSWC)
Naval Air Systems Command (NAVAIR)
Office of Naval Research (ONR)
Omega Point Laboratory (OPL)
PBI Performance Products
Perales Manufacturing, Inc. (PMI)
StanChem
Raytheon Company
Texas Research Institute/Austin (TRI-Austin)
Collaborators
USA
K. Marshall, K. McAlea, 3D Systems
J. Ly, P. Marchol, W. Tam, Aerojet
R. Blanski, M. Fernandez, L. Knox, D. Marchant, J. Mabry, K. McFall, H. Nguyen, S. Phillips, P. Ruth, S. Svejda, R. Vaia, AFRL
F. Saremi, Aldila Composites Materials
W. Shih, Allcomp
D. Burton, C. Leer-Lake, M. Lake, P. Lake, Applied Sciences
D. Mihalicik, Aspen Aerogels
J. Bowen, A. Chamseddine, S. Zimlim, Augmentix
J. Ventura, Bayer MaterialScience
T. Postick, Carbon Nanotechnologies
T. Grupa, C. Pederson, J. Weispfenning, Cytec Solvay Group
J. Moore, Daetec
M. Johnson, Y. Hou, Downhole Technology
J. Buffy, Dyna-Tek
P. Van Dine, Electric Boat
M. C. Lin, Emory U
K. Holder, Essentium
K. Mahaffy, Exquadrum
J. Fisher, Fifth Gait Technologies
R. Liang, A. Hao, Florida State U
S. Menon, V. Yang, Georgia Tech
G. Pruett, Hitco Carbon Composites
J. Lichtenhan, Hybrid Plastics
M. Mutton, D. Yuhas, IMS
A. Grand, S. Romo, Intertek
J. McGrath, J. O’Neil, P. Wiehold, Johns Hopkins U Applied Physics Lab
S. Das, Lonza
A. Mekjian, Mektech Composites
L. Drzal, A. Lee, Michigan State U
C. Pittman, Y. Wang, Mississippi State U
B. Wardle, MIT
S. Mudrich, Momentive
B. Dyatkin, M. Lakoski, Naval Research Lab (NRL)
T. Duenes, J. Roe, Nanoarmor
T. Lan, Nanocor
K. Chuang, NASA GRC
S. Bouslog, NASA JSC
U. Sorathia, Naval Surface Warfare Center
K. Shivakumar, North Carolina A&T U
D. Thompson, C. Xu, North Carolina State U
G. Stein, Northrop Grumman Corp
M. Ewing, Northrop Grumman Innovation Systems
J. Morral, The Ohio State U
R. Perales, Perales Manufacturing, Inc.
G. Copeland, PBI Performance Products
F. Cheung, K. Kuo, R. Yetter, The Pennsylvania State U
C. Ibeh, Pittsburg State U
L. Pilato, Pilato Consulting
C. Buchler, Pyromeral Systems Inc.
P. Chua, Raytheon Company
J. Agee, J. Lou, Rice U
Y. Chang, J. Slavens, Sasol NA
S. Jones, SMJ Carbon
A. Bray, SMRC
J. El-Hibri, G. Jack, Solvay Advanced Polymers
D. Hunter, Southern Clay Products
D. Hunter, Southern Clay Products
J. Koenig, B. Patel, Southern Research Institute (SR)
M. Hussain, C. West, StanChem
Z. P. Luo, Texas A&M U
P. Cassidy, M. Londa, J. Tate, S. Venumbaka, W. Wootan, Texas State U
H. Stretz, TN Tech U
R. Rushing, B. Muskopf, TRI-Austin
G. Wissler, 21st Century Polymers
J. Abot, M. Schulz, V. Shanov, U of Cincinnati
A. Morgan, U of Dayton Research Institute
K. Brezinsky, U of Illinois-Chicago
H. Phoehn, U of South Carolina
Faculty and staff members: O. Atak, J. Beaman, B. Rech, D. Bourell, S. Chen, N. Clemens, C. Deckard, O. Ezekoye, P. Ferreira, P. Ho, J. Howell, M. Krifa, M. Lewis, W. Li, T. Moon, R. Moser, R. Ruoff, L. Shi, F. Stefani, and R. Zowarka
Students: E. Allcorn, M. Baek, R. Borduin, M. Bruns, Y. Chang, D. Chen, J. Cheng, A. Cummings, A. Duncan, W. Fahy, K. Gregory, A. Gupta, B. Hadisujoto, A. Hall, A. Hao, W. Ho, M. Jaramillo, B. Johnson, A. Jor, M. Kan, J. Keena, H. Kim, S. Kim, Y. Kim, C. Lam, S. Lao, J. Langston, V. Lau, J. Lee, J. Lewis, K. Li, E. Lim, E. Liu, B. Lisco, C. Lu, T. Luce, J. Malinoff, A. Mercado, R. McDermott, J. Mendez, R. Menz, M. Namazka, K. Ngyuen, B. Ong, E. Onyegam, D. Pinero, B. Rockwell, G. Russell, A. Sallean, R. Shah, A. Scott, T. Silverman, B. South, K. Schellhase, G. Su, R. Tatuaca, T. Templin, D. Victory, C. Wong, D. Wong, I. Wong, C. Wu, H. Wu, C. Yang, E. Yao, C. Yee, X. Yin, J. Yong, W. Yong, M. Yuan, and others, The U of Texas at Austin
S. Tan, WMR
J. Misasi, WWU
M. Knox, XG Sciences
Australia
S. Bateman, A. Kafi, RMIT University, Australia
Brazil
A. Avila, U Federal de Minas Gerais, Brazil
U. de Barros Lima, Nacional de Grafite, Brazil
China
W. K. Chow, Hong Kong Polytechnic U, Hong Kong, China
Y. Dong, Suzhou University of Science and Technology, China
L. Yao, Donghua U, China
Korea
J. Lee, Agency for Defense Development, Korea
K. W. Hyung, Jenoju U, Korea
Estonia
I. Grodnensky, T. Ferland, ANF Technology, USA and Estonia
France
G. Filou, P. Piccione, R. Reber, Arkema, USA and France
M. Berdoyes, B. Broquere, Ariane, France
Germany
R. Fecteau, L. Mueller, Evonik, USA and Germany
S. Sprenger, Evonik/Nanoresins, USA and Germany
S. Sathyanarayana, Fraunhofer ICT, Germany
Hungary
Z. Horvath, Res Inst for Tech Phys and Mat Sc, Hungary
Italy
M. Natali, U of Perugia, Italy
Japan
Y. Iida, C. Kanayama, K. Shimazak, K. Takada, Thinky, USA and Japan
Portugal
F. van Hattum, U of Minho, Portugal
Switzerland
T. Reilly, Clariant, USA and Switzerland
United Arab Emirates
K. Shanmugam, Masdar Institute of Science and Technology, UAE
