- USA
- K. Marshall, K. McAlea, 3D Systems
- J. Ly, P. Marchol, W. Tam, Aerojet
- R. Blanski, M. Fernandez, L. Knox, D. Marchant, J. Mabry, K. McFall, H. Nguyen, S. Phillips, P. Ruth, S. Svejda, R. Vaia, AFRL
- F. Saremi, Aldila Composites Materials
- W. Shih, Allcomp
- D. Burton, C. Leer-Lake, M. Lake, P. Lake, Applied Sciences
- D. Mihalicik, Aspen Aerogels
- J. Bowen, A. Chamseddine, S. Zimlim, Augmentix
- J. Ventura, Bayer MaterialScience
- T. Postick, Carbon Nanotechnologies
- C. Pederson, J. Weispfenning, Cytec Engineered Materials
- J. Moore, Daetec
- M. Johnson, Y. Hou, Downhole Technology
- P. Van Dine, Electric Boat
- M. C. Lin, Emory U
- K. Mahaffy, Exquadrum
- J. Fisher, Fifth Gait Technologies
- R. Liang, Florida State U
- S. Menon, V. Yang, Georgia Tech
- G. Pruett, Hitco Carbon Composites
- J. Lichtenhan, Hybrid Plastics
- M. Mutton, D. Yuhas, IMS
- A. Grand, S. Romo, Intertek
- S. Das, Lonza
- A. Mekjian, Mektech Composites
- L. Drzal, A. Lee, Michigan State U
- C. Pittman, Mississippi State U
- L. Daniel, B. Wardle, MIT
- S. Mudrich, Momentive
- T. Lan, Nanocor
- K. Chuang, NASA-GRC
- S. Bouslog, NASA-JSC
- U. Sorathia, Naval Surface Warfare Center
- K. Shivakumar, North Carolina A&T U
- G. Stein, Northrop Grumman Corp
- J. Morral, The Ohio State U
- R. Perales, Perales Manufacturing, Inc.
- G. Copeland, PBI Performance Products
- F. Cheung, K. Kuo, R. Yetter, The Pennsylvania State U
- C. Ibeh, Pittsburg State U
- L. Pilato, Pilato Consulting
- C. Buchler, Pyromeral Systems Inc.
- P. Chua, Raytheon Company
- J. Agee, J. Lou, Rice U
- Y. Chang, J. Slavens, Sasol NA
- S. Jones, SMJ Carbon
- A. Bray, SMRC
- J. El-Hibri, G. Jack, Solvay Advanced Polymers
- D. Hunter, Southern Clay Products
- M. Hussain, C. West, StanChem
- Z. P. Luo, Texas A&M U
- P. Cassidy, M. Londa, J. Tate, S. Venumbaka, W. Wootan, Texas State U
- H. Stretz, TN Tech U
- R. Rushing, B. Muskopf, TRI-Austin
- G. Wissler, 21st Century Polymers
- J. Abot, M. Schulz, V. Shanov, U of Cincinnati
- A. Morgan, U of Dayton Research Institute
- K. Brezinsky, U of Illinois-Chicago
- H. Phoehn, U of South Carolina
- Faculty members: J. Beaman, D. Bourell, S. Chen, C. Deckard, O. Ezekoye, P. Ferreira, P. Ho, J. Howell, M. Krifa, W. Li, T. Moon, R. Moser, R. Ruoff, L. Shi, & Students: E. Allcorn, M. Baek, R. Borduin, M. Bruns, D. Chen, J. Cheng, A. Cummings, A. Duncan, K. Gregory, A. Gupta, B. Hadisujoto, A. Hall, A. Hao, W. Ho, M. Jaramillo, B. Johnson, A. Jor, M. Kan, J. Keena, Y. Kim, C. Lam, S. Lao, V. Lau, J. Lee, J. Lewis, K. Li, B. Lisco, C. Lu, T. Luce, J. Malinoff, A. Mercado, M. Namazka, K. Ngyuen, B. Ong, E. Onyegam, D. Pinero, B. Rockwell, G. Russell, A. Sallean, A. Scott, T. Silverman, B. South, G. Su, R. Tatuaca, D. Victory, C. Wong, D. Wong, I. Wong, C. Wu, H. Wu, E. Yao, C. Yee, X. Yin, J. Yong, W. Yong, M. Yuan, and others, U of Texas at Austin
- S. Tan, WMR
- M. Knox, XG Sciences
- ONR-MURI with Penn State, Emory U, Georgia Tech, Ohio State, UI-Chicago, UT-Austin
- Brazil
- A. Avila, U Federal de Minas Gerais, Brazil
- U. de Barros Lima, Nacional de Grafite, Brazil
- China
- W. K. Chow, Hong Kong Polytechnic U, Hong Kong, China
- Y. Dong, Suzhou University of Science and Technology, China
- Korea
- J. Lee, Agency for Defense Development, Korea
- K. W. Hyung, Jenoju U, Korea
- Estonia
- I. Grodnensky, ANF Technology, USA and Estonia
- France
- G. Filou, P. Piccione, Arkema, France
- B. Broquere, Snecma, France
- Germany
- T. Reilly, Clariant, USA and Germany
- G. Horlbeck, Evonik, USA and Germany
- S. Sathyanarayana, Fraunhofer ICT, Germany
- M, King, S. Sprenger, Evonik/Nanoresins, USA and Germany
- Hungary
- Z. Horvath, Res Inst for Tech Phys and Mat Sc, Hungary
- Italy
- M. Natali, U of Perugia, Italy
- Japan
- E. Kuramoto, Thinky, USA and Japan
- Portugal
- F. van Hattum, U of Minho, Portugal
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